测试方法描述 (Test method description)： 　　可焊性试验的条件为：a、有铅锡可焊性试验温度为：245±5℃；b、无铅锡可焊性试验温度为：265±5℃。具体试验操作按IPC-TM-650操作。 Test method is ： a、HASL Solderability test temperature：245±5℃ b、HAL-Lead Free Solderability test temperature：265±5℃. Please refer to immersion tin test operation instruction for detail. 测试标准Test standard： 目视铜箔无不沾锡、锡面针孔等不良情况；至少95%的焊点完全润湿,至多允许5%的焊点半润湿,不允许出现不上锡现象（主要指SMT焊盘）；各镀通孔应完全浸润锡，直径小于1.5mm的孔允许有不完全填满锡，但必须是完全覆盖有锡；无绿油变色、起泡、甩油、起皱、板面白点、爆孔、爆板等。 　　　 There is no unbalanced adhering coating of copper and tin pinholes by visual, covers a minimum of 95% of the surface being wetted, a maximum of 5% of the surface being half-wetted, the unbalanced adhering coating of solder is not allowed (mostly is solder pad of SMT), the PTH shall be wetted completely of tin . The holes which diameter is less than 1.5mm could be filled in inadequacy but the surface shall covered by tin completely.The S/M no discolorations,no blisters,no solder mask peeling off,no wrinkling,no measles; no blowing hole and no delamination.