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PCB工程部专业英文词汇-7,CAM工程培训,CAM培训,CAM工程师培训,Genesis培训,Genesis2000培训,起点CAM培训|PCB培训|PCB工程师培训|PCB抄板培训
i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)
J.
喷锡(Hot Air Solder Leveling)

j-1
水平喷锡(Horizontal Hot Air Solder Leveling)
j-2
垂直喷锡
( Vertical Hot Air Solder Leveling)
j-3
超级焊锡
(Super Solder )
j-4.
印焊锡突点
(Solder Bump)
K.
成型(Profile)(Form)

k-1
捞型(N/C Routing ) (Milling)
k-2
模具冲
(Punch)
k-3
板面清洗烘烤
(Cleaning & Backing)
k-4 V
型槽
( V-Cut)(V-Scoring)
k-5
金手指斜边
( Beveling of G/F)
L.
开短路测试(Electrical Testing) (Continuity & Insulation Testing)

l-1 AOI
光学检查( AOI Inspection)
l-2 VRS
目检
(Verified & Repaired)
l-3
泛用型治具测试
(Universal Tester)
l-4
专用治具测试
(Dedicated Tester)
l-5
飞针测试
(Flying Probe)
M.
终检( Final Visual Inspection)

m-1
压板翘( Warpage Remove)
m-2 X-OUT
印刷
(X-Out Marking)
m-3
包装及出货
(Packing & shipping)
m-4
目检
( Visual Inspection)
m-5
清洗及烘烤
( Final Clean & Baking)
m-6
护铜剂
(ENTEK Cu-106A)(OSP)
m-7
离子残余量测试
(Ionic Contamination Test )(Cleanliness Test)
m-8
冷热冲击试验
(Thermal cycling Testing)
m-9
焊锡性试验
( Solderability Testing )
N.
雷射钻孔(Laser Ablation)

N-1
雷射钻Tooling(Laser ablation Tooling Hole)
N-2
雷射曝光对位孔
(Laser Ablation Registration Hole)
N-3
雷射Mask制作
(Laser Mask)
N-4
雷射钻孔
(Laser Ablation)
N-5 AOI
检查及
VRS ( AOI Inspection & Verified & Repaired)
N-6 Blaser AOI (after Desmear and Microetching)
N-7
除胶渣
(Desmear)
N-8
微蚀(Microetchin