d-9 去溢胶(resin flush removal)
E. 减铜(Copper Reduction)
e-1 薄化铜(Copper Reduction)
F. 电镀(Horizontal Electrolytic Plating)
f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating)
f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)
f-3 低于1 mil ( Less than 1 mil Thickness )
f-4 高于1 mil ( More than 1 mil Thickness)
f-5 砂带研磨(Belt Sanding)
f-6 剥锡铅( Tin-Lead Stripping)
f-7 微切片( Microsection)
G. 塞孔(Plug Hole)
g-1 印刷( Ink Print )
g-2 预烤(Precure)
g-3 表面刷磨(Scrub)
g-4 后烘烤(Postcure)
H. 防焊(绿漆/绿油): (Solder Mask)
h
h-2 S面印刷(Printing Bottom Side)
h-3 静电喷涂(Spray Coating)
h-4 前处理(Pretreatment)
h-5 预烤(Precure)
h-6 曝光(Exposure)
h-7 显影(Develop)
h-8 后烘烤(Postcure)
h-9 UV烘烤(UV Cure)
h-10 文字印刷( Printing of Legend )
h-11 喷砂( Pumice)(Wet Blasting)
h-12 印可剥离防焊(Peelable Solder Mask)
I . 镀金Gold plating
i-1 金手指镀镍金( Gold Finger )
i-2 电镀软金(Soft Ni/Au Plating)