加入收藏
在线咨询 Advisory
热线电话
Hotline

136-2049-9088

教学资料
PCB工程教材

首页 > PCB工程教材

PCB工程部专业英文词汇-6,CAM工程培训,CAM培训,CAM工程师培训,Genesis培训,Genesis2000培训,起点CAM培训|PCB培训|PCB工程师培训|PCB抄板培训
d-8 铣靶(spot face)
d-9
去溢胶
(resin flush removal)
E.
减铜(Copper Reduction)

e-1
薄化铜(Copper Reduction)
F.
电镀(Horizontal Electrolytic Plating)

f-1
水平电镀(Horizontal Electro-Plating) (Panel Plating)
f-2
锡铅电镀
( Tin-Lead Plating ) (Pattern Plating)
f-3
低于
1 mil ( Less than 1 mil Thickness )
f-4
高于
1 mil ( More than 1 mil Thickness)
f-5
砂带研磨
(Belt Sanding)
f-6
剥锡铅
( Tin-Lead Stripping)
f-7
微切片
( Microsection)
G.
塞孔(Plug Hole)

g-1
印刷( Ink Print )
g-2
预烤
(Precure)
g-3
表面刷磨
(Scrub)
g-4
后烘烤
(Postcure)
H.
防焊(绿漆/绿油): (Solder Mask)

h-1 C
面印刷(Printing Top Side)
h-2 S
面印刷
(Printing Bottom Side)
h-3
静电喷涂
(Spray Coating)
h-4
前处理
(Pretreatment)
h-5
预烤
(Precure)
h-6
曝光
(Exposure)
h-7
显影
(Develop)
h-8
后烘烤
(Postcure)
h-9 UV
烘烤
(UV Cure)
h-10
文字印刷
( Printing of Legend )
h-11
喷砂
( Pumice)(Wet Blasting)
h-12
印可剥离防焊
(Peelable Solder Mask)
I .
镀金Gold plating

i-1
金手指镀镍金( Gold Finger )
i-2
电镀软金(Soft Ni/Au Plating)