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PCB工程部专业英文词汇-5,CAM工程培训,CAM培训,CAM工程师培训,Genesis培训,Genesis2000培训,起点CAM培训|PCB培训|PCB工程师培训|PCB抄板培训

PCB生产经典流程英文培训教程

 

A. 开料( Cut Lamination)
a-1 裁板( Sheets Cutting)
a-2
原物料发料
(Panel)(Shear material to Size)
B.
钻孔(Drilling)

b-1
内钻(Inner Layer Drilling )
b-2
一次孔
(Outer Layer Drilling )
b-3
二次孔
(2nd Drilling)
b-4
雷射钻孔
(Laser Drilling )(Laser Ablation )
b-5
()孔钻孔
(Blind & Buried Hole Drilling)
C.
干膜制程( Photo Process(D/F))

c-1
前处理(Pretreatment)
c-2
压膜
(Dry Film Lamination)
c-3
曝光
(Exposure)
c-4
显影
(Developing)
c-5
蚀铜
(Etching)
c-6
去膜
(Stripping)
c-7
初检
( Touch-up)
c-8
化学前处理,化学研磨
( Chemical Milling )
c-9
选择性浸金压膜
(Selective Gold Dry Film Lamination)
c-10
显影
(Developing )
c-11
去膜
(Stripping )
Developing , Etching & Stripping ( DES )
D.
压合Lamination

d-1
黑化(Black Oxide Treatment)
d-2
微蚀
(Microetching)
d-3
铆钉组合
(eyelet )
d-4
叠板
(Lay up)
d-5
压合
(Lamination)
d-6
后处理
(Post Treatment)
d-7
黑氧化( Black Oxide Removal )