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PCB工程部专业英文词汇-2,CAM工程培训,CAM培训,CAM工程师培训,Genesis培训,Genesis2000培训,起点CAM培训|PCB培训|PCB工程师培训|PCB抄板培训
  1. 槽孔:slot hole
  2. 邮票孔:snap off hole 或者stamp hole
  3. 导通孔:via hole
  4. 盲孔: blind via hole
  5. 埋孔:buried via hole
  6. 金属化孔:PTH(plated through hole)
  7. 非金属化孔:NPTH( no plated through hole)
  8. 孔位:hole location
  9. 避免:avoid
  10. 原设计:original design
  11. 修改:modify
  12. 按原设计:follow up original design
  13. 附边:waste tab, waste area 或者breakaway tab
  14. 铜条:copper strip
  15. 拼板:panel drawing
  16. 板厚:board thickness
  17. 删除:remove(delete)
  18. 削铜:shave the copper
  19. 露铜:copper exposure 或者exposed copper
  20. 光标点: fiducial mark
  21. 不同:be different from(differ from)
  22. 内弧:inside radius
  23. 焊环:annular ring
  24. 单板尺寸:single size
  25. 拼板尺寸:panel size
  26. ,锣:routing
  27. 铣刀:router 或者Routing bit
  28. 楔形掏槽 V-cut 或者V scoring
  29. 哑光:matt
  30. 光亮的:glossy
  31. 锡珠:solder ball(solder plugs)
  32. 阻焊:solder mask(solder resist)
  33. 阻焊开窗:solder mask opening
  34. 单面开窗:single side mask opening
  35. 补油:touch up solder mask
  36. 补线:track welds
  37. 毛刺:burrs
  38. 去毛刺:deburr
  39. 镀层厚度:plating thickness
  40. 清洁度:cleanliness
  41. 离子污染:ionic contamination
  42. 阻燃性等级:flammability retardant rating
  43. 黑化:black oxidation
  44. 棕化:brown oxidation
  45. 红化:red oxidation
  46. 可焊性不良:poor solderability
  47. 焊料:solder
  48. 包装:packaging
  49. 角标:corner mark
  50. 特性阻抗:characteristic impedance
  51. 正像:positive
  52. 负片:negative
  53. 镜像:mirror
  54. 线宽:line width 或者trace width
  55. 线距:line spacing 或者 trace spacing
  56. 做样:build sample
  57. 按照:according to
  58. 成品:finished
  59. 做变更:make the change
  60. 相类似:similar to
  61. 规格:specification
  62. 下移:shift down
  63. 垂直地:vertically
  64. 水平的:horizontally
  65. 增大:increase
  66. 缩小:decrease